MCP2122T-E/SN by microchip technology
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产品说明书

MCP2122T-E/SN

Microchip Technology

Infrared Encoder/Decoder - 115.2KBd - 8-Pin SOIC N - Tape&Reel .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
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供应商:
Microchip Technology
部件编号:
MCP2122T-E/SN
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
3300
封装类型:
REEL
最大工作电源电压:
5.5 V
最大数据速率:
115.2 KBd
尺寸:
4.9 x 3.9 x 1.25(Min) mm
系列:
MCP2122
最小工作电源电压:
1.8 V
类别:
Infrared Encoder/Decoder
安装方式:
Surface Mount
The MCP2122T-E/SN is an infrared encoder/decoder module designed for easy integration into various applications. It operates at a high baud rate of 115.2KBd and features an 8-pin SOIC N package. This module is supplied in Tape&Reel packaging, ensuring efficient handling and storage. With its reliable infrared encoding and decoding capabilities, the MCP2122T-E/SN is an excellent choice for projects requiring seamless wireless communication.
搜索关键词:
MCP2122TESN
有存货: 4,950
发货 today, 输入设置值。
最小订购数量:
250
工厂交货期
6 周
价格 (USD)
数量
单价
总价
250
$0.974
$243.500
500
$0.965
$482.500
1,000
$0.955
$955.000
3,300
$0.780
$2,574.000
6,600
$0.779
$5,141.400
9,900
$0.777
$7,692.300
13,200
$0.775
$10,230.000
16,500 +
$0.773
$12,754.500
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF Product Change Notification

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