MCP6547T-I/MS by microchip technology
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产品说明书

MCP6547T-I/MS

Microchip Technology

Comparator Dual R-R I/O 5.5V Automotive 8-Pin MSOP T/R .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
MCP6547T-I/MS
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
2500
封装类型:
REEL
最大功耗:
N/A
制造商类型:
General Purpose Comparator
系列:
MCP6547
最大工作电源电压:
5.5 V
最大输入偏置电流:
0.000001(Typ)@5.5V uA
最大双电源电压:
N/R
最大传播延迟时间:
8000 ns
尺寸:
3 x 3 x 0.85 mm
最大输入偏置电压:
7@5.5V mV
The MCP6547T-I/MS is a dual voltage comparator that is specifically designed for automotive applications. It features a rail-to-rail input/output capability and operates at a maximum voltage of 5.5V. This comparator is housed in an 8-pin MSOP package and is supplied in tape and reel packaging. With its automotive-grade reliability and compact form factor, the MCP6547T-I/MS is an excellent choice for a wide range of automotive electronic systems.
搜索关键词:
MCP6547TIMS
有存货: 2,500
可立即发货
最小订购数量:
500
工厂交货期
22 周
价格 (USD)
数量
单价
总价
500
$0.5778
$288.9000
1,000
$0.5652
$565.2000
2,500
$0.4947
$1,236.7500
5,000
$0.4935
$2,467.5000
7,500
$0.4922
$3,691.5000
10,000
$0.4910
$4,910.0000
15,000
$0.4898
$7,347.0000
25,000 +
$0.4885
$12,212.5000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 13-Jul-2011 - Microchip Has Released A New Devicedoc For The Listed Mcp651/1S/2/3/4/5/9 Data Sheet Of Devices In O
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 13-Jul-2011 - Data Sheet-Mcp651/1S/2/3/4/5/9 Data Sheet Data Sheet Document Revision
PDF PCN - 09-Jul-2010 - QUALIFICATION OF SPECIFIC DEVICE FAMILIES IN THE 8LMSOP PACKAGE AT MMS TEST SITE
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 25-Jun-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 09-Feb-2012 - Microchip Has Released A New Devicedoc For The Listed Mcp6546/6R/6U/7/8/9 Datasheet Of Devices.
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 09-Feb-2012 - Microchip Has Released A New Devicedoc For The Mcp6546/6R/6U/7/8/9 Datasheet Of Devices
PDF PCN - 01-Feb-2011 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi
PDF PCN - 30-Jul-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 27-May-2010 - Microchip is announcing the qualification of listed device families in the 8LMSOP package at MMS tes
PDF PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 12-Mar-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 20-Mar-2009 - QUALIFICATION OF 8L & 10L MSOP WITH 8200T EPOXY AND G600 MOLD COMPOUND AT UTL ASSEMBLY
PDF PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag
PDF PCN - 31-Dec-2011 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

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