PIC18F4420-I/PT by microchip technology
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产品说明书

PIC18F4420-I/PT

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 44 - Package type: TQFP 44 – Speed 40 MHz - Flash 16 KB – SRAM 768 Bytes – EEPROM 256 Bytes - I/O: 36 – A/D: 10 bit with 13 channels – 04 Timers – MSSP – CCP – .. 查看完整描述

符合 RoHS
TRAY 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
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找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC18F4420-I/PT
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
160
封装类型:
TRAY
程序存储器容量:
16 KB
RAM容量:
768 B
工作温度:
-40 to 85 °C
ADC分辨率:
10 bit
可编程I/O数量:
34
程序存储器类型:
Flash
The MICROCHIP TECH PIC18F4420-I/PT is part of PIC18 family with a 8-Bit RISC microcontroller. It can sustain standard temperature ranges from -40°C to + 85 C, has 44 pin in TQFP-44 package and 40 MHz clock speed. This device has a Flash memory of 16 KB, a SRAM of 768 bytes, EEPROM of 256 bytes, four timers module and 13 channels of 10 bits ADC. This MCU includes MSSP & EUSART communication modules (I2C & SPI modules) with 36 I/O pins. It can be used to achieve various tasks.
搜索关键词:
PIC18F4420IPT
有存货: 800
可立即发货
最小订购数量:
5
工厂交货期
4 周
价格 (USD)
数量
单价
总价
5
$5.84
$29.20
25
$5.64
$141.00
50
$5.59
$279.50
160
$5.55
$888.00
320
$5.52
$1,766.40
640
$5.51
$3,526.40
1,120
$5.49
$6,148.80
2,560 +
$5.48
$14,028.80
供应商标准包装
产品更改
PDF PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 01-Dec-2005 - Product Change Notice
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB
PDF PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa
PDF Product Change Notification

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