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PIC24FJ64GA004-I/PT by microchip technology
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产品说明书

PIC24FJ64GA004-I/PT

Microchip Technology

PIC/DSPIC Microcontroller 16-bit - General Purpose - PIC24 Family PIC24FJ GA Series Microcontrollers - 32 MHz - 64KB Flash - 2.5V/3.3V - 44-Pin. .. 查看完整描述

符合 RoHS
TRAY 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC24FJ64GA004-I/PT
RoHS:
Yes
HTS:
8542310020
COO:
PH
ECCN:
3A991.a.2
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
160
封装类型:
TRAY
程序存储器类型:
Flash
可编程I/O数量:
35
RAM容量:
8 KB
程序存储器容量:
64 KB
ADC分辨率:
10 bit
工作温度:
-40 to 85 °C
The PIC24FJ64GA004-I/PT is a 16-bit 64kB general purpose Flash Microcontroller with a broad peripheral feature set and enhanced computational performance. The PIC24FJ64GA004 family offers a new migration option for those high-performance applications which may be outgrowing their 8-bit platforms, but don't require the numerical processing power of a digital signal processor. The PIC24FJ64GA004 family incorporates a range of serial communication peripherals to handle a range of application requirements. The PIC24FJ64GA004 family of devices contains internal Flash program memory for storing and executing application code. The memory is readable, writable and erasable when operating with VDD over 2.25V.
搜索关键词:
PIC24FJ64GA004IPT
  提供不同的包装选项。  查看替代品
有存货: 4,375
可立即发货
最小订购数量:
5
工厂交货期
21 周
价格 (USD)
数量
单价
总价
5
$4.57
$22.85
50
$3.73
$186.50
160
$3.46
$553.60
320
$3.45
$1,104.00
640
$3.44
$2,201.60
1,120
$3.43
$3,841.60
2,560
$3.42
$8,755.20
5,120 +
$3.41
$17,459.20
供应商标准包装
产品更改
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 11-Jan-2008 - Qualification of 0.25u embedded flash with HDR memory for PIC24 products at neew wafer fabrication s
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 27-Apr-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE
PDF PCN - 26-Feb-2013 - PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 18-May-2013 - DATA SHEET - PIC24FJ64GA004 FAMILY DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE
PDF PCN - 01-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 30-Nov-2007 - CHANGE IN BOM
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of masks UDAAx, UFACx, UGABx and YGAYx at an additional wa
PDF PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 01-Oct-2010 - ERRATA-PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 22-Apr-2008 - QUALIFICATION OF 0.25U EMBEDDED FLASH WITH HDR MEMORY FOR PIC24 AT NEW WAFER FABRICATION SITE
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 18-May-2013 - Microchip has released a new devicedoc for the PIC24FJ64GA004 family data sheet of devices in order
PDF PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa
PDF PCN - 17-Dec-2013 - Microchip is announcing the qualification of palladium coated copper (PdCu) wire at MTAI assembly si
PDF PCN - 11-Dec-2015 - ERRATA - PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 29-Mar-2010 - ERRATA-PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.
PDF PCN - 23-Nov-2011 - ERRATA-PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 18-May-2013 - ERRATA - PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED
PDF PCN - 13-Feb-2010 - DATA SHEET-PIC24FJ64GA004 FAMILY DATA SHEET
PDF PCN - 13-Feb-2010 - Microchip has released a new DeviceDoc for the PIC24FJ64GA004 Family Data Sheet of devices.
PDF PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 01-Mar-2010 - ERRATA - PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 26-Feb-2013 - PIC24FJ64GA004 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF Product Change Notification

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