The G800W306018EU is an AgilBrick™ 2.54mm board-to-board header from Amphenol ICC designed for flexible, cost-effective interconnect solutions in various electronic applications. It features customizable pin lengths including contact pin and solder tail, with support for multiple mounting configurations such as vertical DIP, right angle DIP, vertical SMT, and right angle SMT. The header delivers a 3A AC/DC current rating at 250V DC with an operating temperature range of -25°C to +105°C, utilizing high-temperature thermoplastic insulation (UL 94V-0 rated) and copper alloy contacts with selective gold plating. Key mechanical characteristics include a contact retention force of 1.20 kgf minimum before solder and 0.90 kgf minimum after solder, with a maximum insertion force of 350g per pin and a durability rating of 300 cycles. This header is ideal for communications, portable devices, medical equipment, and control board applications, offering RoHS compliance, halogen-free construction, and enhanced reliability through reflow compatibility and PIP process support.