The 532602B02500G is a dual radial board-level heat sink intended for cooling TO-220 and TO-220-single gauge semiconductor packages. Constructed from aluminum with a black anodize finish, it provides effective thermal management for high-power components. This heat sink is designed for vertical mounting and has dimensions of 41.91 mm in width, 25.40 mm in length, and 38.10 mm in height. It is suitable for board-level cooling applications where efficient heat dissipation is critical for system reliability and performance.