593202B03500G
Boyd Laconia LLCThe 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. 查看完整描述
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供应商:
Boyd Laconia LLC
部件编号:
593202B03500G
别名/又称:
042686
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
供应商标准包装
800
封装类型:
Bulk
器件冷却方式:
TO-220
安装方式:
N/A
尺寸:
35.05 x 12.2 x 50.8mm
热阻:
10.4 °C/W
表面处理:
Black Anodized
The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.
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593202B03500G
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