The 7023B-MTG is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features a vertical mounting orientation and requires a mounting kit for device attachment. The heat sink dimensions are 48.26 mm width, 24.13 mm length, and 49.53 mm height, with mounting hole specifications of X: 13.97 mm (0.550 in), Y: 3.18 mm (0.125 in), and Z: 3.10 mm (0.122 in). The device is RoHS compliant and provides thermal management through natural or forced air convection, with thermal performance varying based on air velocity. This heat sink is ideal for applications requiring compact board-level thermal solutions for power semiconductor packages in industrial, automotive, and consumer electronics.