3551805001 is a high-speed interconnect component from Cinch's CIN::APSE product line, designed for solderless Z-axis compression mount applications. The system enables signal frequencies greater than 20 GHz with contact centerline spacing of 1mm or greater and compressed signal path lengths as short as 0.8 mm. It features molybdenum contact material and supports custom I/O configurations with counts from 1 to over 5,000. Common applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB connections, and parallel PCB to PCB interconnections in commercial, military, and aerospace environments.