The 2504023017Y0 is a multi-layer chip bead designed to suppress conducted EMI signals in high-density circuit board applications. It features a 0402 (1005) package size with typical impedance of 300O ±25% at 100 MHz, maximum DC resistance of 0.75O, and maximum current rating of 100 mA. The bead operates at standard signal speed and is supplied taped and reeled on 7" reels with 10,000 parts per reel. Its compact dimensions (0.5 mm × 0.5 mm × 1.0 mm) and low weight of 0.002 g enable automated placement and dense packaging on modern circuit boards. This component is ideal for cellular phones, computers, laptops, and other portable devices requiring effective EMI filtering in space-constrained designs.