The 2506036007Y3 is a multi-layer chip bead designed for conducted EMI signal suppression in compact electronic devices. It features a 0603 (1608) package size with typical impedance of 60 O ±25% at 100 MHz, maximum DC resistance of 0.04 O, and maximum current rating of 3000 mA, making it suitable for high-density circuit board applications. The bead is manufactured with standard signal speed material and is supplied taped and reeled on 7" reels with 4000 parts per reel. Common applications include cellular phones, computers, laptops, and pagers, where the small package size enables automated placement and dense packaging while effectively suppressing conducted EMI signals.