25LC256-I/ST by microchip technology
图片仅供参考 - 请查看制造商规格
产品说明书

25LC256-I/ST

Microchip Technology

EEPROM - Serial-SPI - 256Kb (32K x 8) - 3.3V/5V - 8-Pin TSSOP - Tube .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
25LC256-I/ST
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
100
封装类型:
TUBE
数据保持:
200(Min) Year
The MICROCHIP TECH. part 25LC256-I/ST is an EEPROM memory chip with a capacity of 256Kb, or 32K x 8, suitable for use in various applications. It operates at voltages of 3.3V or 5V, offering versatility in different circuit designs. The chip utilizes a Serial-SPI interface for easy integration into existing systems. Encased in an 8-Pin TSSOP package, this chip provides a compact solution while maintaining reliable performance. It is supplied in a tube packaging, ensuring safe transportation and storage.
搜索关键词:
25LC256IST
  提供不同的包装选项。  查看替代品
有存货: 2,050
可立即发货
最小订购数量:
100
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。:
100
工厂交货期
23 周
价格 (USD)
数量
单价
总价
100
$1.51
$151.00
300
$1.50
$450.00
500
$1.48
$740.00
1,000
$1.47
$1,470.00
2,500
$1.46
$3,650.00
5,000
$1.45
$7,250.00
7,500
$1.44
$10,800.00
10,000 +
$1.43
$14,300.00
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 03-Jun-2004 - QUALIFY UNISEM MALAYSIA FOR ASSEMBLY OF 8L TSSOP PACKAGE FOR PB-FREE RELEASE
PDF PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 19-Mar-2007 -
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 28-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 12-Apr-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Mar-2007 - QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Jan-2013 - DATA SHEET - 25AA256/25LC256 DEVICE DATA SHEET
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Jan-2013 - Microchip has released a new devicedoc for the 25AA256/25LC256 device data sheet of devices.
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Jul-2021 - DATA SHEET - 25AA256/25LC256 256K SPI BUS SERIAL EEPROM
PDF PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K
PDF PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 13-Jul-2006 -
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 28-Aug-2019 - MICROCHIP HAS RELEASED A NEW PRODUCT DOCUMENTS FOR THE 25AA256/25LC256 DEVICE DATA SHEET OF DEVICES
PDF PCN - 15-Oct-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K
PDF PCN - 12-Apr-2012 - Microchip is announcing the qualification of MMT (ALPH) assembly site for the listed 8L TSSOP packag
PDF PCN - 28-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH BOND WIRE FOR SELECTED PRODUCTS
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 27-Sep-2004 - CHANGE FROM SNPB PLATING TO MATTE TIN PLATING (INDUSTRY-STANDARD PURE SN) OF THE DEVICE LEADS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 03-Jun-2004 -
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY
PDF PCN - 01-Feb-2006 -
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 18-Sep-2018 - 25LCXXX 8K-256K SPI SERIAL EEPROM HIGH TEMP FAMILY DATA SHEET
PDF PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING
PDF PCN - 06-Mar-2006 -
PDF PCN - 11-Nov-2004 -
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K
PDF PCN - 15-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

© 2026 ECCO GROUP ECIA

Powered by nopCommerce