93LC56BT-I/OT by microchip technology
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产品说明书

93LC56BT-I/OT

Microchip Technology

EEPROM - Serial Microwire - 3.3V/5V - 2 Kbit (128 x 16) - 3 MHz - 6 Pin SOT-23 - Tape&Reel .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
93LC56BT-I/OT
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
3000
封装类型:
REEL
数据保持:
200(Min) Year
The 93LC56BT-I/OT is a 2kb low-voltage Microwire-compatible serial Electrically Erasable PROM (EEPROM), word-selectable device such as the 93AA56C, 93LC56C or 93C56C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX56A devices are available, while the 93XX56B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications.
搜索关键词:
93LC56BTIOT
  提供不同的包装选项。  查看替代品
有存货: 38,000
可立即发货
最小订购数量:
1000
工厂交货期
17 周
价格 (USD)
数量
单价
总价
1,000
$0.3153
$315.3000
3,000
$0.2702
$810.6000
6,000
$0.2695
$1,617.0000
9,000
$0.2689
$2,420.1000
12,000
$0.2682
$3,218.4000
15,000
$0.2675
$4,012.5000
27,000
$0.2668
$7,203.6000
51,000 +
$0.2662
$13,576.2000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 22-Jan-2004 -
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 08-Nov-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 30-Jan-2006 -
PDF PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 09-Dec-2011 - DATA SHEET-93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 2K MICROWIRE-COMPATIBLE SERIAL EEPROM
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L DFN 2X3MM AT AIC
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 10-Jan-2006 -
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 21-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 23-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 11-Nov-2004 -
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of the listed 6L SOT-23 package products with SG-8300GM mo
PDF PCN - 06-Mar-2006 -
PDF PCN - 16-Dec-2005 - QUALIFICATION OF6L SOT-23PACKAGE AT MTAI
PDF PCN - 23-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 3, 5 and 6L SOT-23 package products with SG-
PDF PCN - 09-Dec-2011 - Microchip has released a new devicedoc for the listed 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 2K microw
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 06-Nov-2003 -
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 27-Sep-2004 - CHANGE FROM SNPB PLATING TO MATTE TIN PLATING (INDUSTRY-STANDARD PURE SN) OF THE DEVICE LEADS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 09-May-2005 -
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 17-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 08-Mar-2007 -
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 16-Dec-2005 - QUALIFICATION OF6L SOT-23PACKAGE AT MTAI

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