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DSPIC33EP512MU810-I/PF by microchip technology
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产品说明书

DSPIC33EP512MU810-I/PF

Microchip Technology

MCU - 16-bit dsPIC - 536KB Flash - 52KB RAM - -40°C to +85°C - 3.3V - 100-Pin TQFP - Tray .. 查看完整描述

符合 RoHS
TRAY 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
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找到的产品: 0
供应商:
Microchip Technology
部件编号:
DSPIC33EP512MU810-I/PF
RoHS:
Yes
HTS:
8542310020
COO:
TW
ECCN:
3A991.a.2
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
90
封装类型:
TRAY
RAM容量:
52 KB
程序存储器容量:
536 KB
工作温度:
-40 to 85 °C
可编程I/O数量:
83
程序存储器类型:
Flash
ADC分辨率:
12/12 bit
The DSPIC33EP512MU810-I/PF is a 16-bit microcontroller and Digital Signal Controller with high-speed PWM, USB and advanced analogue. The digital signal controller (DSCs) features a 70 MIPS dsPIC® DSC core with integrated DSP and enhanced on-chip peripherals. These DSCs enable the design of high-performance, precision motor control systems that are more energy efficient, quieter in operation, have a great range and extended life. They can be used to control brushless DC, permanent magnet synchronous, AC induction and stepper motors. This device is also ideal for high-performance general purpose applications.
搜索关键词:
DSPIC33EP512MU810IPF
有存货: 101
可立即发货
最小订购数量:
5
工厂交货期
13 周
价格 (USD)
数量
单价
总价
5
$11.54
$57.70
25
$10.45
$261.25
90
$9.91
$891.90
180
$9.54
$1,717.20
270
$9.52
$2,570.40
540
$9.50
$5,130.00
1,080 +
$9.43
$10,184.40
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 04-Nov-2015 - ERRATA-DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA DOCUMENT REVISION
PDF PCN - 15-Jan-2014 - Microchip is announcing the qualification of the listed 100L TQFP (14x14x1mm) package products with
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 18-Oct-2012 - Microchip has released a new devicedoc for the dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/G
PDF PCN - 25-Aug-2017 - UPDATED SILICON ISSUE 3 (CPU) AND 28 (CPU) 2) ADDED SILICON ISSUE 39 (CPU)
PDF PCN - 27-Mar-2019 - CORRECTED THE ESTIMATED FIRST SHIP DATE YEAR FOR 100L TQFP FROM 2018 TO 2019
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 03-Aug-2011 - Microchip has released a new devicedoc for the listed dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 21-Dec-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 22-Nov-2011 - DSPIC33EPXXXMU8XX AND PIC24EPXXXGU81X ERRATA & DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 04-Nov-2015 - ERRATA-DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA DOCUMENT REVISION
PDF PCN - 18-Oct-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 DATA SHEET DOCUMENT REVISION
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 18-Oct-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 DATA SHEET DOCUMENT REVISION
PDF PCN - 25-Oct-2019 - ERRATA - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 18-Aug-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH PALLADIUM COATED COPPER BOND WIRE
PDF PCN - 15-Jan-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH GOLD (AU) WIRE AT ASE ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 15-Jan-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH PALLADIUM COATED COPPER BOND WIRE
PDF PCN - 08-Mar-2019 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 25-Aug-2017 - UPDATED SILICON ISSUE 3 (CPU) AND 28 (CPU) 2) ADDED SILICON ISSUE 39 (CPU)
PDF PCN - 27-Feb-2012 - Microchip has released a new devicedoc for the listed dsPIC33EPXXX(GP/MC/MU)806/810/8 4 and PIC24EPX
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 27-Feb-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 DATA SHEET DATA SHEET
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Aug-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 15-Jan-2014 - QUALIFICATION OF 100L TQFP (14X14X1MM) PACKAGE WITH PALLADIUM COATED COPPER BOND WIRE
PDF PCN - 02-Aug-2019 - FINAL NOTICE IMPLEMENT NEW PACKING MATERIAL
PDF PCN - 11-Dec-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 30-Aug-2011 - Microchip has released a new devicedoc for the listed MCP621/2/4/5/9 data sheet of devices in order
PDF PCN - 25-Jul-2014 - QUALIFICATION OF ASE ASSEMBLY SITE FOR 100L TQFP (14X14X1MM) PACKAGE WITH GOLD (AU) WIRE
PDF PCN - 30-Mar-2012 - DSPIC33EPXXX(GP/MC/MU)806/810/814 AND PIC24EPXXX(GP/GU)810/814 ERRATA DOCUMENT REVISION
PDF PCN - 15-Jan-2014 - Microchip is announcing the qualification of the listed 100L TQFP (14x14x1mm) package products with
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

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