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MCP1525T-I/TT by microchip technology
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MCP1525T-I/TT

Microchip Technology

Voltage Reference - Precision - Series - Fixed - 2.5V - 8mA - SOT-23-3 - 3-Pin. .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
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供应商:
Microchip Technology
部件编号:
MCP1525T-I/TT
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
3000
封装类型:
REEL
最大温度系数:
50 ppm/°C
安装方式:
Surface Mount
系列:
MCP1525
最大输出电流:
8(Typ) mA
初始精度:
1 %
最大输入电压:
7 V
负载调整率:
1.3 mV/ mA
电源调整率:
350 uV/V
尺寸:
2.9 x 1.3 x 0.95 mm
The MCP1525T-I/TT is a low power, high precision voltage reference in 3 pin SOT-23 package. This voltage reference is normally used in 3V to 5V systems where wide variations in supply voltage exists and need to minimize power dissipation. The MCP1525 use combination of an advanced CMOS circuit design and EEPROM trimming to provide an initial tolerance of 1% and temperature stability of 50ppm/°C. This device offers clear advantage over traditional zener techniques in terms of stability across time and temperature.
搜索关键词:
MCP1525TITT
有存货: 34,450
可立即发货
最小订购数量:
500
工厂交货期
9 周
价格 (USD)
数量
单价
总价
500
$0.906
$453.000
1,000
$0.895
$895.000
3,000
$0.843
$2,529.000
6,000
$0.840
$5,040.000
9,000
$0.824
$7,416.000
12,000
$0.821
$9,852.000
15,000
$0.814
$12,210.000
27,000 +
$0.812
$21,924.000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 12-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 3, 5 and 6L SOT-23 package products with SG-
PDF PCN - 19-Oct-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Mar-2007 -
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of the listed 6L SOT-23 package products with SG-8300GM mo
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Nov-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 12-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 19-Oct-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 22-Jan-2004 -
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 30-Jan-2006 -
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF Product Change Notification

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