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MCP1650S-E/MS by microchip technology
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MCP1650S-E/MS

Microchip Technology

DC/DC Cntrlr Single-OUT Step Up 850kHz Automotive 8-Pin MSOP Tube .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
MCP1650S-E/MS
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
100
封装类型:
TUBE
最大电源电流:
N/A
最大功耗:
N/A
最大输入电压:
5.5 V
尺寸:
3 x 3 x 0.85 mm
系列:
MCP1650
输出数量:
1
安装方式:
Surface Mount
最小输入电压:
2.7 V
最大开关频率:
850 kHz
The MCP1650S-E/MS is a highly efficient DC/DC controller specifically designed for automotive applications. Its single-output step-up functionality allows for a compact and reliable voltage boost in an automotive power supply system. With a switching frequency of 850kHz, it enables high-speed operation while minimizing component size and cost. This 8-pin MSOP packaged device ensures easy integration into automotive designs, making it ideal for various automotive power management applications.
搜索关键词:
MCP1650SEMS
有存货: 500
发货 today, 输入设置值。
最小订购数量:
100
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100
工厂交货期
5 周
价格 (USD)
数量
单价
总价
100
$1.35
$135.00
300
$1.30
$390.00
500
$1.28
$640.00
1,000
$1.22
$1,220.00
2,500
$1.21
$3,025.00
5,000
$1.20
$6,000.00
7,500
$1.19
$8,925.00
10,000 +
$1.18
$11,800.00
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 25-Jun-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 12-Mar-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

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