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MCP1700T-3302E/TT by microchip technology
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产品说明书

MCP1700T-3302E/TT

Microchip Technology

Fixed LDO Voltage Regulator - 2.3V to 6V - 178mV Dropout - 3.3Vout - 250mAout. .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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找到的产品: 0
供应商:
Microchip Technology
部件编号:
MCP1700T-3302E/TT
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
3000
封装类型:
REEL
功能:
LDO
结到环境热阻:
336(Typ) °C/W
系列:
MCP1700
精度:
±2 %
尺寸:
2.9 x 1.3 x 0.95 mm
结到外壳热阻:
N/A
最大压差电压 @ 电流:
0.35@250mA V
负载调整率:
1(Typ) %
电源调整率:
0.75(Typ) %/V
The MCP1700 is a CMOS low dropout positive voltage regulator which can source up to 250mA of current with an extremely low input-output voltage differential of 178mV at 250mA. The low dropout voltage combined with the low current consumption of only 1.6µA makes this part ideal for battery operation. The low voltage differential (dropout voltage) extends battery operating lifetime. The MCP1700 is stable with 1.0µF ceramic output capacitor. It also permits high currents in small packages when operated with minimum VIN – VOUT differentials. The circuit also incorporates short-circuit protection & over temperature protection to ensure maximum reliability.
搜索关键词:
MCP1700T3302ETT
有存货: 2,000
可立即发货
已订购:
15,000   可以发货 9/14/26 
最小订购数量:
1000
工厂交货期
12 周
价格 (USD)
数量
单价
总价
1,000
$0.3514
$351.4000
3,000
$0.3333
$999.9000
6,000
$0.3291
$1,974.6000
9,000
$0.3283
$2,954.7000
12,000
$0.3210
$3,852.0000
15,000
$0.3202
$4,803.0000
27,000
$0.3171
$8,561.7000
51,000 +
$0.3133
$15,978.3000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products
PDF PCN - 18-Dec-2020 - DATA SHEET - MCP1700 LOW QUIESCENT CURRENT DATA SHEET
PDF PCN - 08-Nov-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 11-Jan-2008 - New test site UTAC THAI of 3L SOT-23 packaged analog products to increase production test capacity.
PDF PCN - 18-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 11-Jan-2008 - Qualification of UTAC THAI Limited to Test 3L SOT-23Packaged Analog Products.
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 11-Jan-2008 - QUALIFICATION OF UTAC THAI LIMITED TO TEST 3L SOT-23 PACKAGED ANALOG PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 08-Mar-2007 -
PDF PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 26-Nov-2018 - DATA SHEET - MCP1700 LOW QUIESCENT CURRENT DATA SHEET CHANGE
PDF PCN - 19-Sep-2016 - DATA SHEET DOCUMENT REVISION
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 09-Nov-2007 - QUALIFICATION OF G600 TYPE MOLD COMPOUNDS FOR SOT-23 PACKAGES AT VARIOUS ASSEMBLY SITES
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 3, 5 and 6L SOT-23 package products with SG-
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of the listed 6L SOT-23 package products with SG-8300GM mo
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 17-Oct-2013 - DATA SHEET - MCP1700 DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 19-Sep-2016 - DATA SHEET DOCUMENT REVISION
PDF PCN - 05-Feb-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 18-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jan-2004 -
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 15-Dec-2006 - NEW BILL OF MATERIALS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 11-Jan-2008 - QUALIFICATION OF UTAC THAI LIMITED TO TEST 3L SOT-23 PACKAGED ANALOG PRODUCTS
PDF PCN - 17-Oct-2013 - Microchip has released a new devicedoc for the MCP1700 data sheet of devices in order to improve pro
PDF PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a
PDF PCN - 30-Jan-2006 -
PDF PCN - 18-Jan-2008 - Qualification Of Utac Thai Limited To Test 3L Sot-23 Packaged Analog Products
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 31-Jan-2007 - New Bill Of Materials
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Jan-2008 - Qualification Of Utac Thai Limited To Test 3L Sot-23 Packaged Analog Products
PDF PCN - 31-Dec-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 31-Oct-2007 - Qualification Of G600 Type Mold Compounds For Sot-23 Packages At Various Assembly Sites
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF Product Change Notification

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