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MCP23008T-E/ML by microchip technology
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产品说明书

MCP23008T-E/ML

Microchip Technology

The MCP23008T-E/ML is an 8-bit I/O expander that provides general-purpose parallel I/O expansion through a high-speed I2C interface. .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
MCP23008T-E/ML
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
3300
封装类型:
REEL
接口速度:
1700 kHz
中断输出:
Yes
接口类型:
I²C
手动复位:
Yes
I2C总线接口模式:
Standard Mode,Fast Mode,Fast Mode Plus
系列:
MCP23008
尺寸:
4 x 4 x 0.88 mm
最大工作电源电压:
5.5 V
The MCP23008T-E/ML is an 8-bit I/O expander designed for general-purpose parallel I/O expansion in I2C bus applications. It features 8 bidirectional I/O pins and supports high-speed I2C communication at 100 kHz, 400 kHz, and 1.7 MHz. The device has three hardware address pins, allowing up to eight MCP23008 devices to share the same bus. It operates over a wide voltage range of 1.8V to 5.5V and an extended temperature range of -40°C to +125°C, with a low standby current of 1 µA. Supplied in a 20-lead QFN package, this expander is ideal for adding I/O capabilities in systems like industrial controls, portable electronics, and servers.
搜索关键词:
MCP23008TEML
  提供不同的包装选项。  查看替代品
有存货: 5,335
可立即发货
最小订购数量:
250
工厂交货期
4 周
价格 (USD)
数量
单价
总价
250
$1.15
$287.50
500
$1.12
$560.00
1,000
$1.11
$1,110.00
3,300
$1.10
$3,630.00
6,600
$1.09
$7,194.00
9,900
$1.08
$10,692.00
13,200
$1.07
$14,124.00
16,500 +
$1.06
$17,490.00
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 08-Mar-2007 -
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (
PDF PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 05-Feb-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo
PDF PCN - 11-Nov-2004 -
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 22-Feb-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a
PDF Product Change Notification

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