help desk software
MCP23S08-E/ML by microchip technology
图片仅供参考 - 请查看制造商规格
产品说明书

MCP23S08-E/ML

Microchip Technology

I/O Expander - 8bit - 10 MHz - SPI - 1.8 to 5.5 V - 20-Pin QFN - Tube .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
MCP23S08-E/ML
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
91
封装类型:
TUBE
最大工作电源电压:
5.5 V
I2C总线接口模式:
N/R
系列:
MCP23S08
接口速度:
10000 kHz
中断输出:
Yes
接口类型:
SPI
尺寸:
4 x 4 x 0.88 mm
手动复位:
Yes
The MCP23S08-E/ML is an 8-bit I/O expander ideally suited for applications requiring additional I/O pins in a compact package. With a 10 MHz SPI interface, this device can seamlessly extend the number of input/output pins in a wide range of embedded systems.Operating at a voltage range of 1.8 to 5.5 V, the MCP23S08-E/ML provides flexibility for use in various applications. Its 20-pin QFN packaging offers a compact form factor, making it suitable for space-constrained designs.This I/O expander from Microchip Technology offers a reliable and efficient solution for projects requiring additional I/O pins, enabling easy expansion and integration with existing systems. Packaged in a tube for convenient handling, the MCP23S08-E/ML is a reliable and versatile device that provides enhanced functionality to any platform requiring extra I/O capabilities.
搜索关键词:
MCP23S08EML
  提供不同的包装选项。  查看替代品
有存货: 5,005
发货 today, 输入设置值。
最小订购数量:
91
多项:
91
工厂交货期
7 周
价格 (USD)
数量
单价
总价
91
$1.49
$135.59
182
$1.45
$263.90
546
$1.38
$753.48
1,001
$1.31
$1,311.31
2,548
$1.30
$3,312.40
5,005
$1.29
$6,456.45
7,553
$1.28
$9,667.84
10,010 +
$1.27
$12,712.70
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X
PDF PCN - 22-Feb-2011 - CCB 1029.02: QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 10-Jun-2011 - QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)
PDF PCN - 11-Nov-2004 -
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 22-Feb-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 08-Mar-2007 -
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 30-May-2011 - Ccb 1029.02: Qualification Of 16 & 20L Qfn (4X4) Packages With Eftec-64T Leadframe At Nseb (Utl)
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 30-Jun-2011 - Qualification Of 16 & 20L Qfn (4X4) Packages With Eftec-64T Leadframe At Nseb (Utl)
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 08-Mar-2007 - Product Change Notice

© 2026 ECCO GROUP ECIA