MCP23S08T-E/SO by microchip technology
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产品说明书

MCP23S08T-E/SO

Microchip Technology

I/O Expander - 8bit - 10 MHz - SPI - 1.8 to 5.5 V - 18-Pin SOIC W - Tape&Reel .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
MCP23S08T-E/SO
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
1100
封装类型:
REEL
接口类型:
SPI
I2C总线接口模式:
N/R
尺寸:
11.55 x 7.5 x 2.05(Min) mm
最大工作电源电压:
5.5 V
中断输出:
Yes
接口速度:
10000 kHz
系列:
MCP23S08
手动复位:
Yes
The MICROCHIP TECH. part MCP23S08T-E/SO is an 8-bit I/O expander that operates at up to 10 MHz using the Serial Peripheral Interface (SPI) communication protocol. This versatile device is designed to work with a wide voltage range of 1.8 to 5.5 V, making it suitable for a variety of applications. It comes in an 18-pin Small Outline Integrated Circuit (SOIC) package with a wide body (W) and is shipped in Tape & Reel packaging for convenience and ease of use.
搜索关键词:
MCP23S08TESO
  提供不同的包装选项。  查看替代品
有存货: 1,139
发货 today, 输入设置值。
最小订购数量:
250
工厂交货期
4 周
价格 (USD)
数量
单价
总价
250
$1.50
$375.00
500
$1.49
$745.00
1,100
$1.24
$1,364.00
3,300
$1.23
$4,059.00
5,500
$1.22
$6,710.00
7,700
$1.21
$9,317.00
11,000 +
$1.20
$13,200.00
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 13-Oct-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 13-Oct-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE
PDF PCN - 07-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 18-Feb-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 12-Oct-2020 - QUALIFICATION OF QMI-519 DIE ATTACH MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 03-Nov-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 09-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 11-Nov-2004 -
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 07-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 13-Feb-2021 - QUALIFICATION OF QMI-519 DIE ATTACH MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 09-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 29-Jun-2016 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 05-Feb-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 16-Aug-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 08-Mar-2007 -
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF Product Change Notification

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