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MCP2510-I/ST by microchip technology
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产品说明书

MCP2510-I/ST

Microchip Technology

CanBus Controller - 5Mbps - Sleep/Standby - 3.3V/5V - 20-Pin TSSOP - Tube .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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找到的产品: 0
供应商:
Microchip Technology
部件编号:
MCP2510-I/ST
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
74
封装类型:
TUBE
系列:
MCP2510
类别:
Controller
尺寸:
6.5 x 4.4 x 1 mm
The MCP2510-I/ST by Microchip Technology is a CanBus Controller designed to facilitate robust and reliable communication between microcontrollers and CAN networks. With a high-speed data rate of up to 5Mbps, this controller enables fast and efficient data transfer. It features sleep and standby modes, allowing for power-saving operation when idle. The MCP2510-I/ST can operate at both 3.3V and 5V, making it adaptable to a wide range of applications. This controller is housed in a compact and durable 20-pin TSSOP package, supplied in a convenient tube for easy handling and storage.
搜索关键词:
MCP2510IST
有存货: 366
发货 today, 输入设置值。
最小订购数量:
5
工厂交货期
16 周
价格 (USD)
数量
单价
总价
5
$4.81
$24.05
74
$3.80
$281.20
148
$3.77
$557.96
296
$3.76
$1,112.96
518
$3.75
$1,942.50
1,036
$3.74
$3,874.64
2,516
$3.73
$9,384.68
5,032 +
$3.72
$18,719.04
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 19-Mar-2007 - QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 17-Jul-2014 - QUALIFICATION OF CDA194 LEAD-FRAME AT ANAP FOR 20L TSSOP 4.4MM WIDTH PACKAGE
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 12-Jan-2006 -
PDF PCN - 07-Oct-2005 - 20L SSOP 207'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 19-Mar-2007 -
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 07-Oct-2005 - 18L SOIC 300'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 07-Oct-2005 -
PDF PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB
PDF PCN - 17-Jul-2014 - QUALIFICATION OF CDA194 LEAD-FRAME AT ANAP FOR 20L TSSOP 4.4MM WIDTH PACKAGE
PDF PCN - 19-Dec-2014 - QUALIFICATION OF CDA194 LEAD-FRAME AT ANAP FOR 20L TSSOP 4.4MM WIDTH PACKAGE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 11-Nov-2004 -
PDF PCN - 12-Jan-2006 - Product Change Notice
PDF PCN - 19-Mar-2007 - Product Change Notice
PDF PCN - 01-Jan-2006 - 20L Ssop 207'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 11-Nov-2004 - Product Change Notice

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