MCP2515-I/P by microchip technology
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产品说明书

MCP2515-I/P

Microchip Technology

CanBus Controller - 1Mbps - 3.3V/5V - Sleep/Standby - PDIP - 18-Pin. .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
MCP2515-I/P
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
25
封装类型:
TUBE
系列:
MCP2515
尺寸:
22.86 x 6.35 x 3.3 mm
类别:
Controller
The MCP2515-I/P is a stand-alone controller area network (CAN) Controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames. The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCU's overhead. The MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI). The device consists of three main blocks, that is CAN module, which includes the CAN protocol engine, masks, filters, transmit and receive buffers. The control logic and registers that are used to configure the device and its operation and the SPI protocol block.
搜索关键词:
MCP2515IP
有存货: 425
可立即发货
最小订购数量:
25
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25
工厂交货期
20 周
价格 (USD)
数量
单价
总价
25
$2.11
$52.75
100
$2.02
$202.00
250
$1.98
$495.00
500
$1.96
$980.00
1,000
$1.93
$1,930.00
2,500
$1.92
$4,800.00
5,000
$1.91
$9,550.00
7,500 +
$1.90
$14,250.00
供应商标准包装
产品更改
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 29-Jan-2019 - DATA SHEET - MCP2515 STAND-ALONE CAN CONTROLLER WITH SPI INTERFACE DATA SHEET
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 25-May-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 09-Dec-2016 - DATA SHEET - MCP2515 DATA SHEET DOCUMENT REVISION
PDF PCN - 17-Nov-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE MCP2515 DATA SHEET OF DEVICES.
PDF PCN - 08-Nov-2010 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 23-Aug-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 18-Dec-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 22-Sep-2011 - QUALIFICATION OF 18L PDIP AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 18-Sep-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 18-Sep-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 18L PDI
PDF PCN - 13-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL
PDF PCN - 09-Dec-2016 - DATA SHEET - MCP2515 DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 05-Aug-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES
PDF PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 17-Nov-2010 - Microchip has released a new DeviceDoc for the listed MCP2515 Data Sheet of devices.
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 07-Oct-2005 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 23-Aug-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 8L PDIP
PDF PCN - 10-Jan-2018 - MCP2515 SILICON ERRATA DOCUMENT REVISION
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 06-Nov-2003 -
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 22-Apr-2021 - DOCUMENT CHANGE
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 18-Dec-2013 - Microchip is announcing the qualification of the listed products in the 28L SPDIP, 8L PDIP, and 18L
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 07-Oct-2005 - 18L SOIC 300'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB
PDF PCN - 13-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 23-Aug-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 10-Jan-2018 - MCP2515 SILICON ERRATA DOCUMENT REVISION
PDF PCN - 28-Aug-2012 - MCP2515 DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 20-Jan-2012 - CCB 1090 FINAL NOTIFICATION: QUALIFICATION OF 18L PDIP AT ALPH (MMT)
PDF PCN - 06-Feb-2014 - Microchip is announcing the qualification of selected products available in the 28L SPDIP, 8L PDIP,
PDF PCN - 26-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 25-May-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 28-Aug-2012 - Microchip has released a new devicedoc for the MCP2515 data sheet of devices in order to improve pro
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 18-Sep-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 11-Nov-2004 -

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