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MCP3001T-I/SN by microchip technology
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产品说明书

MCP3001T-I/SN

Microchip Technology

Single Channel ADC - SAR - 200ksps - 10-bit Serial - Automotive - 8-Pin SOIC N - Tape&Reel .. see full description

符合 RoHS 规定
REEL 包装
附件
附件
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供应商:
Microchip Technology
部件编号:
MCP3001T-I/SN
RoHS:
Yes
HTS:
8542390030
COO:
TH
ECCN:
EAR99
供应商标准包装 This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3300
Package Type:
REEL
Converter Type:
General Purpose
Differential Nonlinearity:
±1 LSB
Digital Supply Support:
No
Architecture:
SAR
Differential Input:
Yes
Digital Interface Type:
Serial (3-Wire, SPI)
Dimension:
4.9 x 3.9 x 1.25(Min) mm
The MICROCHIP TECH. MCP3001T-I/SN is a single channel ADC (Analog-to-Digital Converter) designed for automotive applications. It utilizes the Successive Approximation Register (SAR) architecture and offers a sampling rate of 200,000 samples per second. With a resolution of 10 bits, this ADC provides accurate and precise conversion of analog signals to digital data. The MCP3001T-I/SN operates in a serial communication mode and is housed in an 8-pin Small Outline Integrated Circuit (SOIC) package. It is supplied in Tape & Reel packaging, making it suitable for automated assembly processes.
Search Keywords:
MCP3001TISN
  Different packaging options available.  See Alternatives
有存货: 6,300
可立即发货
Minimum Order Quantity:
250
工厂交货期
7 周
PRICE (USD)
Quantity
Unit Price
Ext. Price
250
$1.64
$410.00
500
$1.62
$810.00
1,000
$1.61
$1,610.00
3,300
$1.60
$5,280.00
6,600
$1.59
$10,494.00
9,900
$1.58
$15,642.00
13,200
$1.57
$20,724.00
16,500 +
$1.56
$25,740.00
Suppliers Standard Package
产品指南
PDF 产品说明书
Product Changes
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

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