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MCP6022T-E/SN by microchip technology
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产品说明书

MCP6022T-E/SN

Microchip Technology

Op Amp Dual GP R-R I/O 5.5V Automotive 8-Pin SOIC N T/R .. see full description

符合 RoHS 规定
REEL 包装
附件
附件
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Product Attribute
Attribute Value Select Attribute
Products found: 0
供应商:
Microchip Technology
部件编号:
MCP6022T-E/SN
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
供应商标准包装 This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3300
Package Type:
REEL
Maximum Input Offset Current:
0.000001(Typ)@5.5V uA
Maximum Operating Supply Voltage:
5.5 V
Manufacturer Type:
General Purpose Amplifier
Maximum Dual Supply Voltage:
N/R
Maximum Input Offset Voltage:
0.25@5V mV
Maximum Input Bias Current:
0.005@5.5V@125C uA
Dimension:
4.9 x 3.9 x 1.25(Min) mm
Family:
MCP6022
The MICROCHIP TECH. MCP6022T-E/SN is a high-performance, dual general-purpose operational amplifier (Op Amp) designed for automotive applications. With a wide input and output range of 5.5V, this Op Amp is capable of operating in harsh automotive environments. It is housed in an 8-pin SOIC package and is supplied on tape and reel for easy handling and integration into manufacturing processes. With its strong performance and automotive-grade reliability, the MCP6022T-E/SN is an excellent choice for a variety of automotive applications requiring precision amplification.
Search Keywords:
MCP6022TESN
  Different packaging options available.  See Alternatives
有存货: 3,225
Ships today, if you order in
Minimum Order Quantity:
250
工厂交货期
5 周
PRICE (USD)
Quantity
Unit Price
Ext. Price
250
$1.33
$332.50
500
$1.32
$660.00
1,000
$1.31
$1,310.00
3,300
$1.30
$4,290.00
6,600
$1.29
$8,514.00
9,900
$1.28
$12,672.00
13,200 +
$1.27
$16,764.00
Suppliers Standard Package
产品指南
PDF 产品说明书
Product Changes
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 28-Jun-2005 - Product Change Notice
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF Product Change Notification

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