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MCP6042-I/SN by microchip technology
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产品说明书

MCP6042-I/SN

Microchip Technology

Dual Op Amp - 14kHz GBP - 600nA - Rail to Rail I/O - 1.4 to 6.0 VDC - -40°C to 85°C - 8-lead SOIC .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
MCP6042-I/SN
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
100
封装类型:
TUBE
最大输入偏置电流:
N/A
最大输入偏置电流差:
0.000001(Typ)@5.5V uA
系列:
MCP6042
最大双电源电压:
N/R
最大输入偏置电压:
3@5.5V mV
制造商类型:
General Purpose Amplifier
尺寸:
4.9 x 3.9 x 1.25(Min) mm
最大工作电源电压:
6 V
The MCP6042-I/SN is a 600nA rail-to-rail input/output Operational Amplifier has a gain bandwidth product of 14kHz with an offset voltage that is less than 3mV. The MCP6041 features advanced CMOS technology provides low bias current, high-speed operation, high open-loop gain and rail-to-rail output swing. The MCP6041 operates with a single supply voltage that can be as low as 1.4V, while drawing less than 1µA of quiescent current. This amplifier is ideal for low-power battery-operated devices and wearable products.
搜索关键词:
MCP6042ISN
  提供不同的包装选项。  查看替代品
有存货: 2,550
发货 today, 输入设置值。
最小订购数量:
100
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。:
100
工厂交货期
4 周
价格 (USD)
数量
单价
总价
100
$0.800
$80.000
300
$0.767
$230.100
500
$0.757
$378.500
1,000
$0.727
$727.000
2,500
$0.691
$1,727.500
5,000
$0.690
$3,450.000
7,500
$0.688
$5,160.000
10,000 +
$0.683
$6,830.000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 03-Jun-2004 - QUALIFY AMKOR SHANGHAI, CHINA (ATC) FOR 8L SOIC PACKAGE
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 04-Mar-2013 - Microchip Has Released A New Devicedoc For The Mcp6041/2/3/4 Datasheet Of Devices In Order To Improv
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP
PDF PCN - 04-Mar-2013 - Data Sheet - Mcp6041/2/3/4 Datasheet Data Sheet Document Revision
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

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