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PIC16C65B-20/P by microchip technology
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产品说明书

PIC16C65B-20/P

Microchip Technology

MCU 8-bit PIC RISC 7KB EPROM 5V 40-Pin PDIP Tube .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC16C65B-20/P
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
10
封装类型:
TUBE
RAM容量:
192 B
工作温度:
0 to 70 °C
程序存储器容量:
7 KB
ADC分辨率:
N/A
程序存储器类型:
EPROM
可编程I/O数量:
33
The PIC16C65B-20/P is a 8-bit microcontroller unit (MCU) from MICROCHIP TECH. It features a PIC RISC architecture, offering high performance and efficiency. The MCU is equipped with 7KB of EPROM memory, providing ample storage for program code and data. Operating at a voltage range of 5V, it ensures reliable operation in various applications. The PIC16C65B-20/P comes in a 40-pin PDIP package, making it easy to interface with other components on a circuit board. It is supplied in a protective tube packaging, ensuring safe transportation and handling.
搜索关键词:
PIC16C65B20P
有存货: 300
发货 today, 输入设置值。
库存数量的起订量:
5
缺货数量的起订量:
35
工厂交货期
27 周
价格 (USD)
数量
单价
总价
5
$7.72
$38.60
10
$7.70
$77.00
25
$7.68
$192.00
35
$7.66
$268.10
70
$5.75
$402.50
105
$5.36
$562.80
140 +
$5.25
$735.00
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 10-Oct-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages
PDF PCN - 18-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages
PDF PCN - 01-Dec-2008 - QUALIFICATION OF 40L PDIP (.6000'') WITH G600 MOLD COMPOUND AT UTL (NSEB) ASSEMBLY
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages With Pdcu
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages
PDF PCN - 27-Sep-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE
PDF PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT
PDF PCN - 01-Dec-2008 - MOLD COMPOUND CHANGE TO G600 & DIE ATTACH EPOXY CHANGE TO 8200T
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 05-Nov-2008 - Microchip has qualified G600C Mold compound and 8361J Die attach epoxy for 18L PDIP .300" (Dual Dice
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 26-Feb-2009 - Microchip has finally qualified G600C Mold compound and 8200T epoxy for 40L PDIP (.600 mil) at UTL (
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 15-Nov-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 12-Sep-2011 - Qualification Of A Larger Lead Frame Paddle Size In 44L Mqfp Package At Alph (Mmt).
PDF PCN - 01-Apr-2006 - QUALIFICATON OF 44L PLCC AT NEW ASSEMBLY SITE: AIC
PDF Product Change Notification

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