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PIC16C711-20I/SS by microchip technology
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PIC16C711-20I/SS

Microchip Technology

Microcontroller - PIC 16C - 8-Bit - 20MHz - 13 I/O - 1.75KB (1K x 14) OTP - 68 x 8 RAM - 4 to 6V - 20-SSOP. .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
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供应商:
Microchip Technology
部件编号:
PIC16C711-20I/SS
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
67
封装类型:
TUBE
The PIC16C711-20I/SS from MICROCHIP TECH. is PIC 16C family 20-Pin SSOP 8-bit CMOS microcontroller. The PIC16C711-20I/SS microcontroller has 1.75KB (1K x 14) OTP program memory, 68 x 8 RAM size, 13 I/O general-purpose I/O pins and 4-channel 8-bit analog-to-digital (A/D) converter. This microcontroller operates at a maximum frequency of 20MHz with operating voltage of 4 to 6V. Operating temperature range is from -40°C to 85°C.
搜索关键词:
PIC16C71120ISS
有存货: 34
可立即发货
已订购:
67   可以发货 9/3/26 
库存数量的起订量:
5
缺货数量的起订量:
34
工厂交货期
53 周
价格 (USD)
数量
单价
总价
5
$7.43
$37.15
10
$7.41
$74.10
25
$7.39
$184.75
34
$7.37
$250.58
67
$5.61
$375.87
101
$5.21
$526.21
134 +
$5.11
$684.74
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300
PDF PCN - 31-Dec-2006 - Addition Of An Assembly Site
PDF PCN - 01-Jan-2006 - 20L Ssop 207'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF Product Change Notification

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