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PIC16F687-I/P by microchip technology
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产品说明书

PIC16F687-I/P

Microchip Technology

MCU 8-bit PIC16 PIC RISC 3.5KB Flash 5V Automotive 20-Pin PDIP Tube .. 查看完整描述

符合 RoHS
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC16F687-I/P
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
供应商标准包装 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
22
封装类型:
TUBE
RAM容量:
128 B
程序存储器容量:
3.5 KB
ADC分辨率:
10 bit
程序存储器类型:
Flash
工作温度:
-40 to 85 °C
可编程I/O数量:
17
The Microchip Tech. part PIC16F687-I/P is a powerful 8-bit microcontroller (MCU) designed for a wide range of automotive applications. This PIC RISC MCU features 3.5KB of Flash memory and operates at 5V. Its 20-pin PDIP package makes it easy to integrate into your designs, and it comes packaged in a protective tube for convenience and durability. Trust the PIC16F687-I/P for reliable performance in your automotive projects.
搜索关键词:
PIC16F687IP
有存货: 0
已订购:
286   可以发货 9/10/26 
最小订购数量:
22
多项:
22
工厂交货期
5 周
价格 (USD)
数量
单价
总价
22
$2.69
$59.18
66
$2.47
$163.02
264
$2.37
$625.68
506
$2.31
$1,168.86
1,012
$2.22
$2,246.64
2,508
$2.21
$5,542.68
5,016
$2.20
$11,035.20
7,502 +
$2.17
$16,279.34
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 21-Dec-2005 - QUALIFICATION OF 20L SOIC (.300'')PACKAGE AT NSEB
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 22-May-2010 - ERRATA-PIC16F631/677/685/687/689/690 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 01-Apr-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT ALPH(MMT) ASSEMBLY SITE
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 01-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MMT ASSEMBLY SITE
PDF PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-Apr-2010 - Microchip is announcing the qualification of 16L & 20L SOIC (.300) at GTK (GRTK) assembly site in or
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2
PDF PCN - 01-May-2006 - QUALIFICATION OF NEW ASSEMBLY SITE
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 16L & 20L SOIC (.300) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Sep-2011 - Microchip is releasing the v9.83 HI-Tech C for the listed PIC10/12/16 MCUs in order to provide new s
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 30-Nov-2007 - CHANGE IN BOM
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 01-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MMT ASSEMBLY SITE
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 16-Jan-2006 - QUALIFICATION OF 20L SOIC AT MMT, THAILAND
PDF PCN - 05-Sep-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES
PDF PCN - 01-Apr-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT ALPH(MMT) ASSEMBLY SITE
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 06-Mar-2006 -
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.
PDF PCN - 11-Nov-2004 -
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

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