PIC18F242T-I/SO by microchip technology
图片仅供参考 - 请查看制造商规格
产品说明书

PIC18F242T-I/SO

Microchip Technology

Microcontroller - PIC 18F - 8-Bit - 40MHz - 23 I/O - 16KB (8K x 16) FLASH - 256 x 8 EEPROM - 768 x 8 RAM - 4.2 to 5.5V - 28-SOIC - T&R.

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC18F242T-I/SO
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
1600
封装类型:
REEL
The PIC18F242T-I/SO is high-performance, enhanced flash microcontroller with A/D 5x10b data converter. Operating temperature range is from -40°C to 85°C.
搜索关键词:
PIC18F242TISO
  提供不同的包装选项。  查看替代品
有存货: 5
可立即发货
购买全部 5 个现货或常规最小订购数量 50
仅库存批次:
5
最小订购数量:
50
工厂交货期
5 周
价格 (USD)
数量
单价
总价
1
$6.611
$6.611
50
$6.010
$300.500
100
$5.940
$594.000
250
$5.840
$1,460.000
500
$5.830
$2,915.000
1,600
$5.810
$9,296.000
3,200 +
$5.780
$18,496.000
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 19-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 06-Apr-2001 - Convert To Sumitomo G-600 Mold Compound In 28L Soic Package At Alph Thailand Assembly Site
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 17-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 09-Sep-2003 - Product Change Notice
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 15-Jul-2002 - MPLAB V5.70 RELEASED
PDF PCN - 08-Mar-2007 - Product Change Notice

© 2026 ECCO GROUP ECIA