PIC18F4520T-I/PT by microchip technology
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产品说明书

PIC18F4520T-I/PT

Microchip Technology

PIC18F Series 32 KB Flash 1.5 kB RAM 40 MHz 8-Bit Microcontroller - TQFP-44 .. 查看完整描述

符合 RoHS
REEL 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证
此产品可能需要额外文件。发货可能会延迟 1-2 天。
产品属性
属性值 选择属性
找到的产品: 0
供应商:
Microchip Technology
部件编号:
PIC18F4520T-I/PT
RoHS:
Yes
HTS:
8542310015
COO:
PH
ECCN:
3A991.a.2
供应商标准包装 供应商原始包装中所含物品的数量、长度、重量或体积，以便高效存储、搬运和配送。
1200
封装类型:
REEL
The Microchip Tech. part PIC18F4520T-I/PT is from the PIC18F series, featuring a 32 KB Flash memory, 1.5 kB RAM, and operating at 40 MHz. This 8-bit microcontroller comes in a TQFP-44 package, making it suitable for a wide range of embedded applications requiring a balance of performance and power efficiency.
搜索关键词:
PIC18F4520TIPT
  提供不同的包装选项。  查看替代品
有存货: 700
可立即发货
库存数量的起订量:
50
缺货数量的起订量:
300
工厂交货期
19 周
价格 (USD)
数量
单价
总价
50
$7.78
$389.00
100
$7.73
$773.00
300
$7.69
$2,307.00
600
$7.67
$4,602.00
900
$7.65
$6,885.00
1,200 +
$6.45
$7,740.00
供应商标准包装
产品指南
PDF 数据表
产品更改
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Dec-2005 - Product Change Notice
PDF PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

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