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PIC24HJ128GP202-I/SP by microchip technology
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产品说明书

PIC24HJ128GP202-I/SP

Microchip Technology

Microcontroller - PIC 24H - 16-Bit - 40 MIPs - 21 I/O - 128KB (43K x 24) OTP Program Memory - 8K x 8 RAM - 3 to 3.6V - 28-SPDIP.

符合 RoHS 规定
TUBE 包装
附件
附件
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
This product may require extra documentation. Shipping may be delayed 1-2 days.
Product Attribute
Attribute Value Select Attribute
Products found: 0
供应商:
Microchip Technology
部件编号:
PIC24HJ128GP202-I/SP
RoHS:
Yes
HTS:
8542310020
COO:
TH
ECCN:
3A991.a.2
供应商标准包装 This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
15
Package Type:
TUBE
The PIC24HJ128GP202-I/SP is microcontroller with operating temperature range from -40°C to 85°C.
Search Keywords:
PIC24HJ128GP202ISP
有存货: 195
可立即发货
库存数量的起订量:
15
缺货数量的起订量:
30
Multiple:
15
工厂交货期
23 周
PRICE (USD)
Quantity
Unit Price
Ext. Price
15
$8.88
$133.20
30
$8.86
$265.80
60
$6.64
$398.40
90
$6.20
$558.00
120 +
$6.08
$729.60
Suppliers Standard Package
产品指南
PDF 产品说明书
Product Changes
PDF PCN - 02-Aug-2012 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB
PDF PCN - 12-Jan-2010 - Errata-Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata
PDF PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.
PDF PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 20-Oct-2010 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 12-Jan-2011 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 24-Nov-2009 - Microchip Has Released A New Devicedoc For The Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128
PDF PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX,YGAUX, YGASX, YGARX,YGAQX MASKS AT AN ADDITIONAL WAFER
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX, YGAUX, YGASX, YGARX, AND YGAQX MASKS AT ADDITIONAL WAFER SITE
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 03-Aug-2011 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic
PDF PCN - 10-Mar-2011 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 03-Aug-2011 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128Gpx02/X04 Data Sheet Document Revision
PDF PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 19-Apr-2012 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128Gpx02/X04 Data Sheet Document Revision
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 13-Jan-2012 - Errata Silicon Die Revision Addition And Errata Document Revision
PDF PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED
PDF PCN - 19-Apr-2012 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 22-Mar-2011 - A New Devicedoc For The Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS
PDF PCN - 25-Jan-2010 - Errata-Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata
PDF Product Change Notification

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