103669-9 is a swaged tall vertical through-hole (THT) header with matte tin plating, part of the AMPMODU MTE interconnect system from TE Connectivity. This header is designed for wire-to-board connectivity applications and features polarization and latching capabilities to ensure secure mating. The product supports 2 to 25 positions per row with 100 mil centerline spacing, accommodates wire gauges from #22 to #30 AWG for IDC configurations, and operates reliably across a temperature range of -65°C to +105°C. With a current rating of 3 amps per single contact in free air and an operating voltage of 267 V, this header is well-suited for industrial applications including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where cost-effective, reliable interconnection is required.