The 103908-7 is a swaged tall vertical through-hole (THT) header designed for the AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced durability and conductivity. This header supports wire-to-board and wire-to-wire interconnection applications with insulation displacement contacts (IDC) or crimp snap-in contacts, accommodating 2 to 25 positions per row with 100 mil centerline spacing. The product operates over a temperature range of -65°C to +105°C and supports current ratings of 3 amps per contact in free air at 267 V operating voltage. The swaged post design provides superior retention in printed circuit boards, making it ideal for industrial applications including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where reliable, polarized, and latching connections are required.