The 1-87499-2 is a single-row receptacle housing assembly part of the AMPMODU Mod IV Interconnection System, designed for wire-to-board connections with dual entry and end-stackable configuration. The housing features a 0.100 inch by 0.100 inch [2.54 x 2.54 mm] centerline spacing with low-profile design and 0.200 inch [5.08 mm] tine spacing, constructed from glass-filled thermoplastic material rated 94V-0. The contact area includes localized gold plating with duplex plating options (Plating A, B, or C) on matte tin solder areas, all over 0.00127 inch [0.00127 mm] nickel, and the assembly is RoHS compliant. This receptacle housing is suitable for applications requiring reliable multi-position interconnections in compact, stackable configurations, with contact current ratings of 3 amperes and termination resistance of 12 milliohms maximum for beryllium copper contacts.