2-1393789-3 is an AXICOM SMT relay from TE Connectivity designed for telecom, signal, and RF applications. The relay features dry packaging to prevent moisture-related issues during soldering, with a peak package body temperature rating of 250°C. It requires handling according to moisture sensitive level (MSL) guidelines, with storage conditions of less than 30°C and 60% RH after opening. Soldering should be performed according to IEC 60068-2-58 recommendations, with reflow profiles supporting preheating temperatures of 150°C to 180°C and peak temperatures up to 255°C. These relays are suitable for applications requiring robust electromechanical switching in telecommunications and signal processing equipment.