2-5176264-1 is a high-density board-to-board connector from the AMPMODU System 50 interconnection system. This connector features 14 positions with contacts spaced on .050 x .100 [1.27 x 2.54] centerline and utilizes Plating B contact finish. The housing is made of glass-filled thermoplastic material with a 94V-0 flammability rating, and contacts are copper alloy with duplex plating including gold in the mating area and tin on solder posts with nickel underplating. The connector includes stand-offs for ease of cleaning and free drainage of flux cleaning solutions. Common applications include board-to-board interconnections in high-density electronic assemblies where reliable signal transmission is required.