5-103639-4 is a wire-to-board receptacle housing assembly designed for the AMPMODU interconnection system with 0.100 inch [2.54 mm] centerline spacing. This product supports multiple position configurations ranging from 1 to 25 positions, with dimensions varying according to position count. The assembly accommodates wire sizes from 30-26 AWG [0.05-0.15 mm²] and 26-22 AWG [0.12-0.3 mm²], with multiple contact plating options including Plating A, B, and C variants. The housing is available in both strip form and individual form configurations, with unloaded housing options for custom assembly. This interconnection system is widely used in industrial control, telecommunications, and consumer electronics applications where reliable wire-to-board connections are required.