2-1393789-6 is an AXICOM SMT relay from TE Connectivity designed for telecom, signal, and RF applications. The relay features moisture-sensitive packaging with dry pack requirements and must be soldered within specified floor life times based on its MSL rating. It supports reflow soldering with peak package body temperatures up to 250°C and preheating temperatures ranging from 150°C to 180°C. The relay is suitable for applications requiring robust electromechanical switching performance in telecommunications and signal processing systems.