The 1-104074-1 is an AMPMODU board-to-board vertical header connector designed for interconnection applications with a 0.050 inch (1.27 mm) centerline spacing. This 10-position header features a glass-filled thermoplastic housing rated 94V-0 and copper alloy contacts with duplex plating: 0.000030 inch (0.00076 mm) gold in the mating area and 0.000150 inch (0.00381 mm) tin on solder posts, with the entire contact underplated 0.000050 inch (0.00127 mm) nickel. The connector has a dimension A of 0.630 inch (16.00 mm) and includes solder clips for reliable board attachment. This connector is ideal for compact board-to-board interconnections in industrial and embedded computing applications requiring robust, repeatable connections.