The 2338495-3 is a 1x4 OSFP cage assembly with open back configuration designed to support next-generation data center connectivity. It features an 8-lane high-density connector with 0.6 mm pitch and 60 contacts total, following the OSFP MSA specification, with a simple low-cost wafer design utilizing 2 rows of contacts. The open back design allows airflow through the module shell to cool downstream electronics in front-to-back airflow systems or exhaust for back-to-front airflow, while the belly-to-belly capable design via in-ground alignment reduces PCB cost and noise. Proven to support 56G PAM-4 protocols with a roadmap to 112G PAM-4, this cage assembly supports aggregate data rates up to 800 Gbps and thermal loads up to 15W with low airflow, making it ideal for high-port-density switch form factors that can accommodate up to 32 ports in a 1RU configuration.