The 5-103168-8 is a 20-position, double-row, shrouded vertical header from the AMPMODU Interconnection System. It features .025 inch square straight posts arranged in a .100 x .100 inch grid. The copper alloy contacts have duplex plating with .000030 inches of gold on the contact area and tin on the solder tails, all over a nickel underplate. Housed in a black, 94V-0 rated flame-retardant thermoplastic with detent windows, this header ensures secure and reliable mating. It is designed for board-to-board applications such as mother/daughter board connections and other subassembly interconnections.