125800D00000G is a BGA solder anchor designed for securing heat sink clips to printed circuit boards. This solder anchor is specifically engineered for PCB thicknesses of 0.100 to 0.110 inches and features an "A" dimension of 4.70 mm (0.185 inches). The product is RoHS compliant and requires 2 to 4 solder anchors to be soldered to the PCB prior to attaching the heat sink clip. Key dimensional specifications include a height of 7.19 mm (0.283 inches), a base width of 7.62 mm (0.300 inches), and a stem diameter of 0.64 mm (0.025 inches). This solder anchor is ideal for thermal management applications where reliable mechanical attachment of heat sinks to BGA packages is required.