The 10-8108 is a non-hazardous, silicone-based heat sink compound formulated to improve thermal conductivity between components. This off-white, odorless paste features a high specific gravity of 2.4 and remains stable across a wide temperature range, with a freezing point of -40°C and a decomposition temperature of 260°C. Composed primarily of zinc oxide, it is insoluble in water and has a high flash point of 204°C. It is ideal for applications requiring efficient and reliable heat transfer from electronic components to heat sinks or chassis.