228-7474-55-1902 is a 28-lead test and burn-in SOIC socket designed for automated handling and high-reliability electrical testing of integrated circuits. The socket features beryllium-copper contacts with 30 µ" gold plating over 50 µ" nickel, providing excellent electrical conductivity and corrosion resistance. The insulation material is glass-filled polyethersulfone (UL 94V-0 rated), and the lid applies 80 grams normal force per lead for maximum electrical reliability. The socket accommodates a 0.330" (8.38 mm) body width SOIC package and is compatible with automated load/unload equipment with top or front lid actuation. Operating specifications include a 1 Amp current rating, insulation resistance greater than 1×10¹² O at 500 Vdc, withstanding voltage of 1000 Vrms at sea level, and an operating temperature range of -55°C to +150°C. This socket is ideal for test and burn-in applications requiring compact envelope design, side-to-side stackability for maximum board density, and reliable contact performance in demanding thermal and electrical environments.