The 10033854-052FSLF is a DDR II 0.6 mm pitch 200-position SO-DIMM connector designed for reverse type assembly applications. This connector features a total height of 5.2 mm and includes a locating peg for precise alignment during installation. The housing is constructed from LCP material with UL94V-0 rating in black color, while contacts are made from copper alloy and hold-down components are brass. The connector terminal contact area is finished with Au flash, the hold-down is finished with pure tin plating, and the solder tail is finished with Au flash. The product meets European Union directives and other country regulations, and the housing can withstand exposure to 260°C peak temperature for 10 seconds in reflow solder applications. This connector is commonly used in memory module applications where reliable high-density interconnection and thermal stability are essential.