SF-1206S250-2
BournsFuse Chip Slow Blow Acting 2.5A 32V SMD Solder Pad 1206 T/R UL .. Ver descripción completa
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Productos Encontrados: 0
Proveedor:
Bourns
Nº de pieza:
SF-1206S250-2
RoHS:
Yes
HTS:
8536100040
COO:
TW
ECCN:
EAR99
Empaque estándar del proveedor
5000
Tipo de encapsulado:
REEL
Tipo:
Chip
Tamaño del fusible:
3.1 x 1.55 x 0.6mm
Acción:
Slow Blow
Corriente Nominal:
2.5 A
Tensión AC Máxima Nominal:
N/A
Tensión DC Máxima Nominal:
32 V
Material del Fusible:
N/A
Montaje:
Surface Mount
SF-1206S250-2 is a slow blow thin film chip fuse designed for overcurrent protection in compact surface mount applications. It features a rated current of 2.5 A with a typical resistance of 33 mO and an I²t value of 0.605 A²s, providing reliable protection with a fusing time within 5 seconds at 250% of rated current. The fuse is housed in a miniature 3216 (EIA 1206) footprint with ceramic substrate construction and Sn plating, suitable for automated assembly and reflow soldering at peak temperatures of 250°C. Operating over a temperature range of -20°C to +105°C, this UL-listed (UL 248-14), RoHS-compliant, and halogen-free fuse is ideal for portable electronics, battery chargers, LCD monitors, and industrial controllers where space constraints and reliable overcurrent protection are essential.
Palabras clave de búsqueda:
SF1206S2502
EN STOCK:
15.000
Envío today, Introduzca el valor de la configuración.
MOQ para Cantidad en Stock:
50
MOQ para cantidad agotada:
1250
Plazo de entrega de fábrica
12 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
50
$0.8822
$44.1100
250
$0.4106
$102.6500
500
$0.4060
$203.0000
1.250
$0.3978
$497.2500
2.500
$0.3938
$984.5000
3.750
$0.3864
$1,449.0000
5.000
+
$0.3824
$1,912.0000
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