375324B00035G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized .. Ver descripción completa
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Proveedor:
Boyd Laconia LLC
Nº de pieza:
375324B00035G
Alias/alias:
035731
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Paquete estándar del proveedor
1
Tipo de paquete:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
10.2 x 10.2 x 10.26714mm
Thermal Resistance:
71.46717°C/W
Finish:
Black Anodized6710
The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.
Palabras clave de búsqueda:
375324B00035G
EN STOCK:
3.316
Puede enviar inmediatamente
MOQ para Cantidad en Stock:
5
MOQ para cantidad agotada:
480
Plazo de entrega de fábrica
9 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
5
$7.401
$37.005
100
$4.615
$461.500
250
$4.365
$1,091.250
480
$4.175
$2,004.000
960
$4.067
$3,904.320
1.440
$3.988
$5,742.720
1.920
+
$3.960
$7,603.200
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