The 7141DG is a narrow channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from copper with a tin-plated finish, it features an integrated mounting clip for secure device attachment and is mounted vertically on the board. The heat sink measures 13.21 mm in width, 13.08 mm in length, and 19.81 mm in height, with dimensional specifications including a "y" dimension of 0.33 mm and a "z" dimension of 2.77 mm. This compact design provides effective thermal management for power devices, with thermal performance varying based on air velocity, making it suitable for applications requiring efficient heat dissipation in space-constrained environments. The product is RoHS compliant, ensuring environmental and regulatory compliance.