24LC1025-I/SM by microchip technology
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24LC1025-I/SM

Microchip Technology

EEPROM - Serial I²C - 1 Mbit (128K x 8) - 2.5V/3.3V/5V - 400 kHz - 8 Pin SOIC-W - Tube .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
24LC1025-I/SM
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
90
Tipo de encapsulado:
TUBE
Retención de Datos:
200(Min) Year
The 24LC1025-I/SM is a 1024kb (128k x 8) Serial Electrically Erasable PROM (EEPROM) capable of operation across a broad voltage range (2.5 to 5.5V). It has been developed for advanced, low-power applications such as personal communications or data acquisition. This device has both byte write and page write capability of up to 128-byte of data. This device is capable of both random and sequential reads. Reads may be sequential within address boundaries 0000h to FFFFh and 10000h to 1FFFFh. Functional address lines allow up to four devices on the same data bus. This allows for up to 4Mb total system EEPROM memory.
Palabras clave de búsqueda:
24LC1025ISM
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 1.770
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
5
Plazo de entrega de fábrica
14 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
5
$4.50
$22.50
90
$3.80
$342.00
180
$3.77
$678.60
270
$3.76
$1,015.20
540
$3.75
$2,025.00
1.080
$3.74
$4,039.20
2.520
$3.73
$9,399.60
5.040 +
$3.72
$18,748.80
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 31-Oct-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 22-Oct-2013 - Microchip is announcing the qualification of the listed 24xx1025, 24xx1026, and 24xx515 device famil
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 12-Aug-2013 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024K I2C CMOS SERIAL EEPROM DATA SHEET DOCUMENT REVISION
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 28-Apr-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE
PDF PCN - 19-Jan-2011 - Microchip has released a new DeviceDoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C? CMOS Ser
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 06-Mar-2006 -
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 18-Apr-2012 - Microchip has released a new devicedoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C CMOS seri
PDF PCN - 28-Apr-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 08-Nov-2021 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024-KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION
PDF PCN - 11-Dec-2009 - Microchip is moving 160K Double Layer Metal (DLM), (0.4 micron)fabrication process to the 160K Tripl
PDF PCN - 11-Nov-2004 -
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C? CMOS Ser
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 19-Feb-2010 - RELEASED A NEW DEVICE DOC
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 01-Nov-2011 - QUALIFICATION OF CERTAIN CATALOG PART NUMBERS IN THE 8L SOIJ PACKAGE WITH 8006NS DIE ATTACH AT MTAI
PDF PCN - 01-Nov-2011 - Microchip is announcing the qualification of certain catalog part numbers in the 8L SOIJ package wit
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat
PDF PCN - 19-Jan-2011 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE SERIAL EEPROM DATA SHEET OF DEVICES.
PDF PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD
PDF PCN - 19-Feb-2010 - Microchip has released a new DeviceDoc for the 24AA1025/24LC1025/24FC1025 1024K I2C CMOS Serial EEPR
PDF PCN - 12-Aug-2013 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024K I2C CMOS SERIAL EEPROM DATA SHEET DOCUMENT REVISION
PDF PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 11-Dec-2009 - CONVERSION OF 24LC1025, 24FC1025 AND 24AA1025 PRODUCT FAMILIES TO 160K TRIPLE LAYER METAL (TLM)
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 03-Aug-2011 - Microchip is announcing the qualification of certain catalog part numbers in the 8L SOIJ package wit
PDF PCN - 29-Oct-2007 - Change in BOM as well as TOP DIE and/or spacer DIE thickness.
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 03-Aug-2011 - QUALIFICATION OF CERTAIN CATALOG PART NUMBERS IN THE 8L SOIJ PACKAGE WITH 8006NS DIE ATTACH AT MTAI
PDF PCN - 12-Aug-2013 - Microchip has released a new devicedoc for the 24AA1025/24LC1025/24FC1025 1024K I2C CMOS serial EEPR
PDF PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 19-Oct-2007 - New assembly site for 24AA /LC/FC Products.
PDF PCN - 22-Oct-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND WITHOUT LEAD LOCK FEATURE
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 31-Oct-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE
PDF PCN - 18-OCT-2023 - Added a new fabrication site
PDF PCN - 07-NOV-2023 - Added a new fabrication site
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF Product Change Notification

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