93LC56BT-I/OT by microchip technology
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FICHA TÉCNICA

93LC56BT-I/OT

Microchip Technology

EEPROM - Serial Microwire - 3.3V/5V - 2 Kbit (128 x 16) - 3 MHz - 6 Pin SOT-23 - Tape&Reel .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Proveedor:
Microchip Technology
Nº de pieza:
93LC56BT-I/OT
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
3000
Tipo de encapsulado:
REEL
Retención de Datos:
200(Min) Year
The 93LC56BT-I/OT is a 2kb low-voltage Microwire-compatible serial Electrically Erasable PROM (EEPROM), word-selectable device such as the 93AA56C, 93LC56C or 93C56C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX56A devices are available, while the 93XX56B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications.
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93LC56BTIOT
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EN STOCK: 38.000
Puede enviar inmediatamente
Cantidad mínima de pedido:
1000
Plazo de entrega de fábrica
17 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
1.000
$0.2943
$294.3000
3.000
$0.2745
$823.5000
6.000
$0.2732
$1,639.2000
9.000
$0.2725
$2,452.5000
12.000
$0.2718
$3,261.6000
15.000
$0.2712
$4,068.0000
27.000
$0.2705
$7,303.5000
51.000 +
$0.2698
$13,759.8000
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 22-Jan-2004 -
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 08-Nov-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 30-Jan-2006 -
PDF PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 09-Dec-2011 - DATA SHEET-93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 2K MICROWIRE-COMPATIBLE SERIAL EEPROM
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L DFN 2X3MM AT AIC
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 10-Jan-2006 -
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 21-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 23-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 11-Nov-2004 -
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of the listed 6L SOT-23 package products with SG-8300GM mo
PDF PCN - 06-Mar-2006 -
PDF PCN - 16-Dec-2005 - QUALIFICATION OF6L SOT-23PACKAGE AT MTAI
PDF PCN - 23-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 3, 5 and 6L SOT-23 package products with SG-
PDF PCN - 09-Dec-2011 - Microchip has released a new devicedoc for the listed 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 2K microw
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 06-Nov-2003 -
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 27-Sep-2004 - CHANGE FROM SNPB PLATING TO MATTE TIN PLATING (INDUSTRY-STANDARD PURE SN) OF THE DEVICE LEADS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 09-May-2005 -
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 17-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 08-Mar-2007 -
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 16-Dec-2005 - QUALIFICATION OF6L SOT-23PACKAGE AT MTAI

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